About ASMPT

ASMPT has established a global presence in over 30 countries, leveraging its strengths in international business networks and resources to drive growth in its core sectors—post-processing equipment, materials, and SMT solutions. Founded in Hong Kong in 1975, the company was the first in the world to provide technology and solutions for all process steps involved in semiconductor packaging and electronic product manufacturing, encompassing everything from semiconductor packaging materials and backend processes (chip integration, bonding, packaging) to SMT processes. No other equipment supplier globally offers a comparable range of products or possesses such extensive knowledge and experience in embedding and SMT programs. The Semiconductor Solutions division manufactures and supplies equipment for semiconductor embedding and packaging, catering to the microelectronics, semiconductor, optoelectronics, and photonics markets. Its diverse product lineup includes die bonding systems, wire bonding systems, dispensing systems, cutting and forming systems, and comprehensive production line equipment. The Materials division produces and supplies semiconductor packaging materials, consisting of lead frame and molded interconnect substrate components. Meanwhile, the SMT Solutions division is responsible for developing and distributing top-tier DEK printers and leading SIPLACE SMT placement solutions for the SMT, semiconductor, and solar markets. Headquartered in Singapore, ASMPT has been listed on the Hong Kong Stock Exchange since 1989.