ASMPT
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ASMPT简介
ASMPT足迹遍布全球30多个国家,集团持续发挥自身在国际业务网络与资源方面的优势,推动其主要业务的增长--后工序设备,物料和SMT解决方案业务份部。 于1975年在香港成立,集团是全球首个为半导体封装及电子产品生产的所有工艺步骤提供技术和解决方案的设备制造商,包括从半导体封装材料和后段(芯片集成、焊接、封装)到SMT工艺。全球并无其他设备供应商拥有类似的全面产品组合及对装嵌及SMT程序的广泛知识及经验。 半导体解决方案分部生产及提供半导体装嵌及封装设备,应用于微电子,半导体,光电子,及光电市场。其提供多元化产品如固晶系统,焊线系统,滴胶系统,切筋及成型系统及全方位生产线设备。物料业务生产及提供半导体封装材料,由引线框架部和模塑互连基板部构成。SMT解决方案业务负责为SMT、半导体和太阳能市场开发和分销一流的DEK印刷机,以及一流的SIPLACESMT贴装解决方案。 ASMPT总部位于新加坡,自1989年起在香港联交所上市。
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